Da Nang is inviting investors to join a high-tech semiconductor packaging lab project worth approximately $70 million, aiming to advance chip manufacturing and AI research in Vietnam.

The Da Nang Department of Finance has issued an invitation for investors to submit applications for approval of investment policy and investor selection for a laboratory project supporting advanced semiconductor packaging technology.

The project, with a total investment of approximately 1,800 billion VND (around 70 million USD), was proposed by VSAP LAB JSC. It will be built in the second Da Nang Software Park, located in Hai Chau District, on a site covering more than 2,200 square meters.

The four-story laboratory will be equipped with state-of-the-art facilities to support research, manufacturing, and testing of semiconductor products.

The project will focus on research and development in the semiconductor and artificial intelligence sectors, and will also create high-tech electrical and electronic products.

In addition, it will provide technical services such as inspection, analysis, installation, maintenance, consulting, and training related to manufacturing operations.

With a design capacity of 10 million products per year, the project is expected to break ground in the second quarter of 2025 and be completed in the fourth quarter of 2026. The facility will operate for 50 years from the date of investment approval.

According to the Da Nang Department of Finance, investor applications will be accepted from May 10 to May 24. The selection process will approve both the investment policy and the investor without requiring a land use rights auction or open bidding.

Ho Giap